Silicon Semiconductor Technology
Processing and Integration of Microelectronic Devices
(Sprache: Englisch)
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS-...
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Klappentext zu „Silicon Semiconductor Technology “
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.Inhaltsverzeichnis zu „Silicon Semiconductor Technology “
Wafer fabrication.- Thermal oxidation.- Lithography.- Etching technology.- Doping techniques.- Chemical and Physical Deposition.- Metallization and Contacts.Autoren-Porträt von Ulrich Hilleringmann
About the AuthorProf. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.Bibliographische Angaben
- Autor: Ulrich Hilleringmann
- 2023, 1st ed. 2023, XI, 264 Seiten, 2 farbige Abbildungen, Masse: 16,8 x 24 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 365841040X
- ISBN-13: 9783658410407
Sprache:
Englisch
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