Photonic Packaging Sourcebook
Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
(Sprache: Englisch)
Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.
Jetzt vorbestellen
versandkostenfrei
Buch (Gebunden)
Fr. 189.00
inkl. MwSt.
- Kreditkarte, Paypal, Rechnungskauf
- 30 Tage Widerrufsrecht
Produktdetails
Produktinformationen zu „Photonic Packaging Sourcebook “
Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.
Klappentext zu „Photonic Packaging Sourcebook “
The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber chip coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
Inhaltsverzeichnis zu „Photonic Packaging Sourcebook “
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.
Autoren-Porträt von Ulrich H. P. Fischer-Hirchert
Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.
Bibliographische Angaben
- Autor: Ulrich H. P. Fischer-Hirchert
- 2015, 2015, XIX, 325 Seiten, 16 farbige Abbildungen, Masse: 16 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 364225375X
- ISBN-13: 9783642253751
- Erscheinungsdatum: 22.04.2015
Sprache:
Englisch
Kommentar zu "Photonic Packaging Sourcebook"
0 Gebrauchte Artikel zu „Photonic Packaging Sourcebook“
Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
---|
Schreiben Sie einen Kommentar zu "Photonic Packaging Sourcebook".
Kommentar verfassen