PCM-Enhanced Building Components

History of PCM applications in buildings.- Overview of basic PCM products used in buildings - encapsulation and packaging methods.- Overview of PCM-enhanced building products worldwide.- Heat transfer in PCM-enhanced building components.- Laboratory and field testing of PCM-enhanced building products and systems.- Thermal and energy modeling of PCM-enhanced building envelopes.- Climate impact on energy performance of PCM-enhanced building envelopes.- Cost reduction analysis for PCM-enhanced building products.- Economical analysis of PCM applications in North American buildings.- PCM-building-product data base.

Dr. Jan Kosny, a winner of a 2009 R&D 100 Award for the development of phase-change materials, is one the world's leading building envelope researchers with over 30 years experiences in the building sciences.  Prior to joining Fraunhofer CSE, Dr. Kosny spent 18 years at Oak Ridge National Laboratory where he developed a number of high-performance wall, roofing, and BIPV concepts.  Holding a number of faculty positions, he has published over 120 technical articles and numerous patents related to advanced building concepts.  He has represented the United States at many international organizations and standards bodies including the International Energy Agency.  He has extensive experience collaborating with industry to commercialize advanced building technologies. From 2002 to 2004, while at Oak Ridge National Laboratory (ORNL) he developed the first ever dynamic thermal insulation - PCM-enhanced cellulose insulation. In 2009 this material became commercially available on the U.S. building market. In 2007, this development was followed by a similar technology using blown fiberglass. Currently, US Army is performing a renovation of military buildings using this material - $2-mln. project was established for this purpose. Currently Dr. Kosny leads the Building Enclosure Program at the Fraunhofer Center for Sustainable Energy Systems in Cambridge, MA, USA.