Moisture Sensitivity of Plastic Packages of IC Devices
(Sprache: Englisch)
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches...
Jetzt vorbestellen
versandkostenfrei
Buch (Gebunden)
Fr. 295.00
inkl. MwSt.
- Kreditkarte, Paypal, Rechnungskauf
- 30 Tage Widerrufsrecht
Produktdetails
Produktinformationen zu „Moisture Sensitivity of Plastic Packages of IC Devices “
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.
Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Klappentext zu „Moisture Sensitivity of Plastic Packages of IC Devices “
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Inhaltsverzeichnis zu „Moisture Sensitivity of Plastic Packages of IC Devices “
- Microelectronics and microsystems packaging technology- Packaging reliability
- Moisture related reliability test and specifications
- Moisture absorption, desorption and transport
- Characterization of moisture behaviors
- Hygroscopic swelling characterization
- Vapor pressure evolution
- Hygro-thermal mechanics
- Caviation instability
- Effect of moisture on material properties
- Electrochemical metal migration and corrosion
- Methodology for accelerated moisture sensitivity test
- Applications
Autoren-Porträt
Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD.
Bibliographische Angaben
- 2010, XIV, 558 Seiten, Masse: 15,5 x 23,5 cm, Gebunden, Englisch
- Herausgegeben: X.J. Fan, E. Suhir
- Verlag: Springer, Berlin
- ISBN-10: 1441957189
- ISBN-13: 9781441957184
Sprache:
Englisch
Kommentar zu "Moisture Sensitivity of Plastic Packages of IC Devices"
0 Gebrauchte Artikel zu „Moisture Sensitivity of Plastic Packages of IC Devices“
| Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
|---|
Schreiben Sie einen Kommentar zu "Moisture Sensitivity of Plastic Packages of IC Devices".
Kommentar verfassen