Materials for Advanced Packaging
(Sprache: Englisch)
This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Jetzt vorbestellen
versandkostenfrei
Buch (Gebunden)
Fr. 200.50
inkl. MwSt.
- Kreditkarte, Paypal, Rechnungskauf
- 30 Tage Widerrufsrecht
Produktdetails
Produktinformationen zu „Materials for Advanced Packaging “
This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Klappentext zu „Materials for Advanced Packaging “
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Inhaltsverzeichnis zu „Materials for Advanced Packaging “
3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.
Bibliographische Angaben
- 2008, XII, 724 Seiten, Masse: 16,6 x 24,6 cm, Gebunden, Englisch
- Herausgegeben: Daniel Lu, C. P. Wong
- Verlag: Springer, Berlin
- ISBN-10: 0387782184
- ISBN-13: 9780387782188
Sprache:
Englisch
Kommentar zu "Materials for Advanced Packaging"
0 Gebrauchte Artikel zu „Materials for Advanced Packaging“
Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
---|
Schreiben Sie einen Kommentar zu "Materials for Advanced Packaging".
Kommentar verfassen