Arbitrary Modeling of TSVs for 3D Integrated Circuits
(Sprache: Englisch)
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact...
Jetzt vorbestellen
versandkostenfrei
Buch (Gebunden)
Fr. 118.00
inkl. MwSt.
- Kreditkarte, Paypal, Rechnungskauf
- 30 Tage Widerrufsrecht
Produktdetails
Produktinformationen zu „Arbitrary Modeling of TSVs for 3D Integrated Circuits “
Klappentext zu „Arbitrary Modeling of TSVs for 3D Integrated Circuits “
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Inhaltsverzeichnis zu „Arbitrary Modeling of TSVs for 3D Integrated Circuits “
Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.Bibliographische Angaben
- Autoren: Khaled Salah , Yehea Ismail , Alaa El-Rouby
- 2014, 2015, IX, 179 Seiten, 99 farbige Abbildungen, Masse: 16 x 24,1 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 3319076108
- ISBN-13: 9783319076102
- Erscheinungsdatum: 05.09.2014
Sprache:
Englisch
Kommentar zu "Arbitrary Modeling of TSVs for 3D Integrated Circuits"
0 Gebrauchte Artikel zu „Arbitrary Modeling of TSVs for 3D Integrated Circuits“
| Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
|---|
Schreiben Sie einen Kommentar zu "Arbitrary Modeling of TSVs for 3D Integrated Circuits".
Kommentar verfassen