Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (ePub)
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
- Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging
- Features experimental characterization and qualifications for the analysis and verification of electronic packaging design
- Provides multiphysics modeling and analysis techniques of electronic packaging
- Autoren: Hengyun Zhang , Faxing Che , Tingyu LIn , Wensheng Zhao
- 2019, 434 Seiten, Englisch
- Verlag: Elsevier Science & Techn.
- ISBN-10: 0081025335
- ISBN-13: 9780081025338
- Erscheinungsdatum: 14.11.2019
Abhängig von Bildschirmgrösse und eingestellter Schriftgrösse kann die Seitenzahl auf Ihrem Lesegerät variieren.
- Dateiformat: ePub
- Grösse: 112 MB
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