Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (PDF)
(Sprache: Englisch)
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present...
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This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
. Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
. Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
Autoren-Porträt von Brandon Noia, Krishnendu Chakrabarty
Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.
Bibliographische Angaben
- Autoren: Brandon Noia , Krishnendu Chakrabarty
- 2013, 2014, 245 Seiten, Englisch
- Verlag: Springer-Verlag GmbH
- ISBN-10: 3319023780
- ISBN-13: 9783319023786
- Erscheinungsdatum: 19.11.2013
Abhängig von Bildschirmgrösse und eingestellter Schriftgrösse kann die Seitenzahl auf Ihrem Lesegerät variieren.
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- Dateiformat: PDF
- Grösse: 6.66 MB
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Englisch
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