Wire Bonding in Microelectronics

Materials, Processes, Reliability, and Yield (Sprache: Englisch)
 
 
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Wire bonding is the attachment of fine wires from semiconductor chips to their substrates a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been...
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Bestellnummer: 17007451

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lieferbar
versandkostenfrei

Bestellnummer: 17007451

BuchFr. 179.90
In den Warenkorb
Wire bonding is the attachment of fine wires from semiconductor chips to their substrates a connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been...

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