Solidification Processing of Metallic Alloys Under External Fields
(Sprache: Englisch)
This book explores the application of external physical fields to the solidification processing of metallic alloys. Leading academics from around the world present comprehensive and critical reviews on state-of-the-art research and discuss...
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This book explores the application of external physical fields to the solidification processing of metallic alloys. Leading academics from around the world present comprehensive and critical reviews on state-of-the-art research and discuss possible future directions. Major physical fields, including electromagnetic, electric, acoustic, and thermal, are considered. In addition, the most advanced synchrotron X-ray based real-time and in-situ studies and numerical modeling methodologies are reviewed and discussed, with a special emphasis on their applications to the solidification processes. Throughout, all chapters are illustrated with both historical and very recent research cases, including typical examples of in-situ studies, modeling, and simulation. This book contains essential knowledge and information suitable for a wide audience, from undergraduate and postgraduate students to academics, practicing researchers, and engineers in materials, metallurgy, and manufacturing.
Inhaltsverzeichnis zu „Solidification Processing of Metallic Alloys Under External Fields “
List of Contributors.- 1 Basics of solidification processing of metallic alloys.- 2 In-situ studies of the dynamics of metal solidification.- 3 Magnetohydrodynamics processing and modelling.- 4 Electromagnetic stirring and low frequency electromagnetic vibration.- 5 High-frequency vibration and ultrasonic processing.- 6 High magnetic fields processing of metal alloys.- 7 Pulse external fields processing of metal alloys.- 8 Thermal melt processing of metallic alloys.- Index.Bibliographische Angaben
- 2019, Softcover reprint of the original 1st ed. 2018, VIII, 320 Seiten, 115 farbige Abbildungen, Masse: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Herausgegeben: Dmitry G. Eskin, Jiawei Mi
- Verlag: Springer, Berlin
- ISBN-10: 3030069249
- ISBN-13: 9783030069247
Sprache:
Englisch
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