Power Distribution Networks with On-Chip Decoupling Capacitors
(Sprache: Englisch)
With more than 100 pages of new content, this updated edition provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors.
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With more than 100 pages of new content, this updated edition provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors.
Klappentext zu „Power Distribution Networks with On-Chip Decoupling Capacitors “
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Inhaltsverzeichnis zu „Power Distribution Networks with On-Chip Decoupling Capacitors “
- Introduction- Inductive Properties of Electric Circuits
- Properties of On-Chip Inductive Current Loops
- Electromigration
- Scaling Trends of On-Chip Power Distribution Noise
- High Performance Power Distribution Systems
- On-Chip Power Distribution Networks
- Computer-Aided Design and Analysis
- Closed Form Expressions for Fast IR Drop Analysis
- Inductive Properties of On-Chip Power Distribution Grids
- Variation of Grid Inductance with Frequency
- Inductance/Area/Resistance Tradeoffs Inductance Model of Interdigitated Power and Ground Distribution Networks
- On-chip Power Noise Reduction Techniques in High Performance ICs
- Impedance/Noise Issues in On-Chip Power Distribution Networks
- Impedance Characteristics of Multi-Layer Grids
- Multi-Layer Interdigitated Power Distribution Networks
- Multiple On-Chip Power Supply Systems
- On-Chip Power Distribution Grids with Multiple Supply Voltages
- Background for Decoupling Capacitance
- Decoupling Capacitors for Multi-Voltage Power
Distribution Systems
- Effective Radii of On-Chip Decoupling Capacitors
- Efficient Placement of Distributed On-Chip Decoupling Capacitors
- Simultaneous Co-Design of Distributed On-Chip Power Supplies and Decoupling Capacitors
- Conclusions
Autoren-Porträt von Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba, Selçuk Köse, Eby G. Friedman
Professor Dr. Eby Friedman, Department of Electrical & Computer Engineering, University of Rochester, Rochester, New York 14627-0231, USA.
Bibliographische Angaben
- Autoren: Renatas Jakushokas , Mikhail Popovich , Andrey V. Mezhiba , Selçuk Köse , Eby G. Friedman
- 2011, 2. Aufl., XXV, 644 Seiten, Masse: 15,5 x 3,6 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1489982329
- ISBN-13: 9781489982322
Sprache:
Englisch
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