Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
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(Sprache: Englisch)
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed...
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To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Klappentext zu „Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces “
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Bibliographische Angaben
- Autor: Nicole Lindenmann
- 2018, 256 Seiten, mit Abbildungen, Masse: 14,8 x 21 cm, Kartoniert (TB), Englisch
- Verlag: KIT Scientific Publishing
- ISBN-10: 3731507463
- ISBN-13: 9783731507468
- Erscheinungsdatum: 13.02.2018
Sprache:
Englisch
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