Dependable Embedded Systems
(Sprache: Englisch)
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from...
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Klappentext zu „Dependable Embedded Systems “
This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today's points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc.- Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems;
- Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers;
- Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems.
Inhaltsverzeichnis zu „Dependable Embedded Systems “
Introduction.- Design of efficient, dependable SoCs based on cross-layer-reliability approach with emphasis on wireless communication as application and DRAM memories.- CRAU: Compositional System-Level Reliability Analysis in the Presence of Uncertainties.- Semantics-aware Soft Error Handling for Embedded Systems using Compiler-OS Interaction.- ARES: Self-Adaptive Coarse-Grained Reconfigurable Architectures as Reliability Enhancers in Embedded Systems.- Cross-Layer Techniques for Dependable Software Execution on Embedded Systems.- Ambrosia: Cross-layer Modeling and Mitigation of Aging Effects in Embedded Systems.- Cross-Layer Dependability for Embedded Hardware/Software Systems.- Fault-Tolerant Computing with Heterogeneous Hardware/Software Hardening Modes.- Robust Computing for Machine Learning-Based Systems.- Hardening embedded system software.- LIFT: Lifting Device-Level Characteristics for Error Resilient System Level Design: A Crosslayer Approach.- VirTherm-3D: Communication Virtualization Enabling System Management for Dependable 3D MPSoCs.- OTERA: Online Test Strategies for Reliable Reconfigurable Architectures.- Variability-Aware Software: Recent Results and Contributions.- EM Lifetime Constrained Optimization for Multi-Segment Power Grid Networks.- Lightweight Software-Assisted Memory Error Correction.- Reliability-Driven Resource Management for Multi-Core Systems-on-Chip.- Monitor Circuits for Device-Circuit Interaction.- PERCIES: Providing Efficient Reliability in Critical Embedded Systems.Autoren-Porträt
Prof. Jörg Henkel is with Karlsruhe Institute of Technology (KIT), Germany, where he is directing the Chair for Embedded Systems CES. Before, he was a Senior Research Staff Member at NEC Laboratories in Princeton, NJ. He received his PhD from Braunschweig University with "Summa cum Laude". Prof. Henkel has/is organizing various embedded systems and low power ACM/IEEE conferences/symposia as General Chair and Program Chair and was a Guest Editor on these topics in various Journals like the IEEE Computer Magazine. He was Program Chair of CODES'01, RSP'02, ISLPED'06, SIPS'08, CASES'09, Estimedia'11, VLSI Design'12, ICCAD'12, PATMOS'13, NOCS'14 and served as General Chair for CODES'02, ISLPED'09, Estimedia'12, ICCAD'13 and ESWeek'16. He is/has been a steering committee member of major conferences in the embedded systems field like at ICCAD, ESWeek, ISLPED, Codes+ISSS, CASES and is/has been an editorial board member of various journals like the IEEE TVLSI, IEEE TCAD, IEEE TMSCS, ACM TCPS, JOLPE etc.
Bibliographische Angaben
- 2020, 1st ed. 2021, XIII, 608 Seiten, 250 farbige Abbildungen, Masse: 16,2 x 24,4 cm, Gebunden, Englisch
- Herausgegeben: Jörg Henkel, Nikil Dutt
- Verlag: Springer, Berlin
- ISBN-10: 3030520161
- ISBN-13: 9783030520168
Sprache:
Englisch
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