Self-Organized 3D Integrated Optical Interconnects (PDF)
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully...
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Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "short line distances of the cm-mm order" and "large line counts of hundreds-thousands." This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.
This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
- Autor: Tetsuzo Yoshimura
- 2021, 1. Auflage, 380 Seiten, Englisch
- Verlag: Taylor & Francis
- ISBN-10: 1000064603
- ISBN-13: 9781000064605
- Erscheinungsdatum: 08.03.2021
Abhängig von Bildschirmgrösse und eingestellter Schriftgrösse kann die Seitenzahl auf Ihrem Lesegerät variieren.
- Dateiformat: PDF
- Grösse: 49 MB
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