Advanced Flip Chip Packaging
(Sprache: Englisch)
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and...
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Klappentext zu „Advanced Flip Chip Packaging “
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Inhaltsverzeichnis zu „Advanced Flip Chip Packaging “
Flip Chip Technology Overview and Early Beginnings.- Technology Trends of Flip Chip.- Bumping Technologies.- Flip-Chip Interconnections: Past, Present and Future.- Underfill.- Conductive Adhesives for Flip Chip Applications.- Enabling Substrate Technologies: Past, Present and Future.- IC-Package-System Integrated Design.- Thermal Management of Flip Chip Packages.- Thermo-Mechanical Reliability in Flip Chip Packages.- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.
Bibliographische Angaben
- 2013, VII, 560 Seiten, Masse: 16 x 24,1 cm, Gebunden, Englisch
- Herausgegeben: Ho-Ming Tong, Yi-Shao Lai, C. P. Wong
- Verlag: Springer, Berlin
- ISBN-10: 1441957677
- ISBN-13: 9781441957672
- Erscheinungsdatum: 21.03.2013
Sprache:
Englisch
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